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NCP699 150 mA CMOS Low Iq LDO with Enable in TSOP-5
The NCP699 series of fixed output LDO's are designed for handheld communication equipment and portable battery powered applications which require low quiescent. The NCP699 series features a very low ground current of 40 mA, independent of load current. Each device contains a voltage reference unit, an error amplifier, a PMOS power transistor, internal resistors for setting output voltage, current limit, and temperature limit protection circuits. The NCP699 has been designed to be used with low cost capacitors. The device is housed in the micro-miniature TSOP-5 surface mount package. Standard voltage versions are 1.5, 1.8, 2.5, 2.8, 3.0, 3.3, and 5.0 V. Other voltages are available in 100 mV steps.
Features http://onsemi.com MARKING DIAGRAM
TSOP-5 (SOT23-5, SC59-5) SN SUFFIX CASE 483 5 xxx AYWG G 1
5 1
* * * * * * * * * * * * *
Enable Control (Active High, Supports Sub 1-Volt Logic) Very Low Ground Current of 40 mA Typical Low Dropout Voltage of 340 mV at 150 mA, and 3.0 V Vout Multiple Fixed Output Voltage Option Output Voltage Accuracy of 2.0% Operating Temperature Range of -40C to 85C Stable with 1 mF Ceramic or Tantalum Capacitors These are Pb-Free Devices
xxx A Y W G
= Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
Vin 1 2 3 (Top View) 4 N/C 5 Vout
Typical Applications
Cellular Phones Battery Powered Consumer Products Hand-Held Instruments Camcorders and Cameras Printers and Office Equipment
Gnd Enable
ORDERING INFORMATION
Battery or Unregulated Voltage Vout Cin 1 mF + 1 2 3 4 5 + Cout 1 mF
See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet.
ON OFF
This device contains 86 active transistors
Figure 1. Typical Application Diagram
(c) Semiconductor Components Industries, LLC, 2007
1
March, 2007 - Rev. 1
Publication Order Number: NCP699/D
NCP699
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PIN FUNCTION DESCRIPTION
Pin No. 1 2 3 4 5 Pin Name Vin Description Positive power supply input voltage. Power supply ground. Gnd Enable N/C This input is used to place the device into low-power standby. When this input is pulled low, the device is disabled. If this function is not used, Enable should be connected to Vin. No internal connection. Vout Regulated output voltage.
MAXIMUM RATINGS
Rating Input Voltage Enable Voltage Output Voltage Power Dissipation Operating Junction Temperature Operating Ambient Temperature Storage Temperature
Symbol Vin Enable Vout PD TJ TA Tstg
Value 2.1 to 6.0 -0.3 to Vin +0.3 -0.3 to Vin +0.3 Internally Limited -40 to +125 -40 to +85 -55 to +150
Unit V V V W C C C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and exceeds the following tests: Human Body Model 2000 V per MIL-STD-883, Method 3015 Machine Model Method 200 V 2. Latch-up capability (85C) "200 mA DC with trigger voltage.
THERMAL CHARACTERISTICS
Rating Junction-to-Ambient PSIJ-Lead 2 NOTE: Symbol RqJA Test Conditions 1 oz Copper Thickness, 100 mm2 1 oz Copper Thickness, 100 mm2 Typical Value 250 68 Unit C/W C/W
Single component mounted on an 80 x 80 x 1.5 mm FR4 PCB with stated copper head spreading area. Using the following boundary conditions as stated in EIA/JESD 51-1, 2, 3, 7, 12.
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NCP699
ELECTRICAL CHARACTERISTICS (Vin = Vout(nom.) + 1.0 V, Venable = Vin, Cin = 1.0 mF, Cout = 1.0 mF, TA = 25C,
unless otherwise noted.) Characteristic Output Voltage (Iout = 10 mA, TA = -40C to 85C) 1.5 V 1.8 V 2.5 V 2.8 V 3.0 V 3.3 V 5.0 V Line Regulation (Iout = 10 mA) 1.5 V-4.4 V (Vin = Vout(nom.) + 1.0 V to 6.0 V) 4.5 V-5.0 V (Vin = 5.5 V to 6.0 V) Load Regulation (Iout = 1.0 mA to 150 mA) Output Current Limit 1.5 V-3.9 V (Vin = Vout(nom.) + 2.0 V) 4.0 V-5.0 V (Vin = 6.0 V) Dropout Voltage (Iout = 150 mA, Measured at Vout = Vout(nom) -3.0%) 1.5 V 1.8 V 2.5 V 2.8 V 3.0 V 3.3 V 5.0 V Disable Current (TA = -40C to 85C) (Enable Input = 0 V) Ground Current (TA = -40C to 85C) (Enable Input = Vin, Iout = 1.0 mA to Io(nom.)) Output Short Circuit Current (Vout = 0 V) 1.5 V-3.9 V (Vin = Vout(nom.) + 2.0 V) 4.0 V-5.0 V (Vin = 6.0 V) Output Voltage Noise (f = 100 Hz to 100 kHz) Iout = 30 mA, Cout = 1 mF Ripple Rejection (f = 120 Hz, 15 mA) (f = 1.0 kHz, 15 mA) Enable Input Threshold Voltage (TA = -40C to 85C) (Voltage Increasing, Output Turns On, Logic High) (Voltage Decreasing, Output Turns Off, Logic Low) Output Voltage Temperature Coefficient 3. Maximum package power dissipation limits must be observed. T *TA PD + J(max) RqJA 4. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. Symbol Vout 1.455 1.746 2.425 2.744 2.94 3.234 4.900 Regline - - - 150 150 Vin-Vout - - - - - - - DIS - IGND - Iout(max) 150 150 Vn - RR - - Vth(en) 0.95 - - - - "100 - 0.3 - 55 50 - - V 100 - dB 300 300 600 600 mVrms 40 90 mA 0.03 1.0 mA 690 570 400 360 340 320 240 750 620 450 420 400 360 300 mA 1.0 1.0 0.3 240 240 3.0 3.0 0.8 - - mV 1.5 1.8 2.5 2.8 3.0 3.3 5.0 1.545 1.854 2.575 2.856 3.06 3.366 5.100 mV/V Min Typ Max Unit V
Regload Io(nom.)
mV/mA mA
TC
ppm/C
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NCP699
TYPICAL CHARACTERISTICS
450 VDD, DROPOUT VOLTAGE (mV) Vout, OUTPUT VOLTAGE (V) 400 350 300 250 200 150 100 50 0 -60 -40 -20 0 20 40 Vin = 4.0 V Vout = 3.0 V Iout = 150 mA 60 80 100 3.015 Vin = 6.0 V 3.010 Vin = 4.0 V 3.005
3.000
2.995 Vout = 3.0 V Iout = 1.0 mA 2.990 -60 -40 -20 0 20 40 60 80 100
TA, AMBIENT TEMPERATURE (C)
TEMPERATURE (C)
Figure 2. Dropout Voltage vs. Temperature
Figure 3. Output Voltage vs. Temperature
43 Iq, QUIESCENT CURRENT (mA) 42 41 40 39 38 37 36 35 -60 -40 -20 0 20 40 Vin = 4.0 V Vout = 3.0 V Iout = 0 mA 60 80 100 Iq, QUIESCENT CURRENT (mA)
60 50 40 30 20 10 0 0 Vout = 3.0 V Iout = 0 mA TA = 25C Cin = 1.0 mF Cout = 1.0 mF 1.0 2.0 3.0 4.0 5.0 6.0 7.0
TEMPERATURE (C)
Vin, INPUT VOLTAGE (V)
Figure 4. Quiescent Current vs. Temperature
60 Ignd, GROUND CURRENT (mA) 50 40 30 20 10 0 0 Vout = 3.0 V Iout = 30 mA TA = 25C Cin = 1.0 mF Cout = 1.0 mF 1.0 2.0 3.0 4.0 5.0 6.0 7.0 70 60 RIPPLE REJECTION (dB) 50 40 30 20 10 0 100
Figure 5. Quiescent Current vs. Input Voltage
Vin = 4.0 V Cout = 1.0 mF Iout = 30 mA
1.0k
10k FREQUENCY (Hz)
100k
1.0M
Vin, INPUT VOLTAGE (V)
Figure 6. Ground Pin Current vs. Input Voltage
Figure 7. Ripple Rejection vs. Frequency
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NCP699
TYPICAL CHARACTERISTICS
7 OUTPUT VOLTAGE NOISE (mV/ Hz) 6 5 4 3 2 1 0 10 100 1.0k 10k 100k 1.0M Vin = 4.0 V Cout = 1.0 mF Iout = 30 mA
FREQUENCY (Hz)
Figure 8. Output Noise Density
Figure 9. Line Transient Response
Figure 10. Load Transient Response
3.5 Vout, OUTPUT VOLTAGE (V) 3.0 2.5 Iout = 1.0 mA 2.0 150 mA 1.5 1.0 0.5
Figure 11. Turn-on Response
TA = 25C 0 0 1.0 2.0 3.0 4.0 5.0 6.0
Vin, INPUT VOLTAGE (V)
Figure 12. Output Voltage vs. Input Voltage
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NCP699
DEFINITIONS
Load Regulation Line Regulation
The change in output voltage for a change in output current at a constant temperature.
Dropout Voltage
The input/output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 3.0% below its nominal. The junction temperature, load current, and minimum input supply requirements affect the dropout level.
Maximum Power Dissipation
The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse technique such that the average chip temperature is not significantly affected.
Line Transient Response
Typical over and undershoot response when input voltage is excited with a given slope.
Thermal Protection
The maximum total dissipation for which the regulator will operate within its specifications.
Quiescent and Ground Current
The quiescent current is the current which flows through the ground when the LDO operates without a load on its output: internal IC operation, bias, etc. When the LDO becomes loaded, this term is called the Ground current. It is actually the difference between the input current (measured through the LDO input pin) and the output current.
Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 160C, the regulator turns off. This feature is provided to prevent failures from accidental overheating.
Maximum Package Power Dissipation
The maximum power package dissipation is the power dissipation level at which the junction temperature reaches its maximum operating value, i.e. 125C. Depending on the ambient power dissipation and thus the maximum available output current.
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NCP699
APPLICATIONS INFORMATION A typical application circuit for the NCP699 series is shown in Figure 1, front page.
Input Decoupling (Cin)
Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible.
Thermal
A 1.0 mF capacitor either ceramic or tantalum is recommended and should be connected close to the NCP699 package. Higher values and lower ESR will improve the overall line transient response. TDK capacitor: C2012X5R1C105K, or C1608X5R1A105K
Output Decoupling (Cout)
The NCP699 is a stable regulator and does not require any specific Equivalent Series Resistance (ESR) or a minimum output current. Capacitors exhibiting ESRs ranging from a few mW up to 5.0 W can thus safely be used. The minimum decoupling value is 1.0 mF and can be augmented to fulfill stringent load transient requirements. The regulator accepts ceramic chip capacitors as well as tantalum capacitors. Larger values improve noise rejection and load regulation transient response. TDK capacitor: C2012X5R1C105K, C1608X5R1A105K, or C3216X7R1C105K
Enable Operation
As power across the NCP699 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material and also the ambient temperature effect the rate of temperature rise for the part. This is stating that when the NCP699 has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power dissipation applications. The maximum dissipation the package can handle is given by:
T *TA PD + J(max) RqJA
If junction temperature is not allowed above the maximum 125C, then the NCP699 can dissipate up to 400 mW @ 25C. The power dissipated by the NCP699 can be calculated from the following equation:
Ptot + [Vin * Ignd (@Iout)] ) [Vin * Vout] * Iout
The enable pin will turn on the regulator when pulled high and turn off the regulator when pulled low. These limits of threshold are covered in the electrical specification section of this data sheet. If the enable is not used then the pin should be connected to Vin.
Hints
or
P ) Vout * Iout VinMAX + tot Ignd(@Iout) ) Iout
Please be sure the Vin and Gnd lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or cause the regulator to malfunction.
If an 150 mA output current is needed then the ground current from the data sheet is 40 mA. For an NCP699 (3.0 V), the maximum input voltage will then be 5.65 V.
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NCP699
ORDERING INFORMATION
Device NCP699SN15T1G NCP699SN18T1G NCP699SN25T1G NCP699SN28T1G NCP699SN30T1G NCP699SN33T1G NCP699SN50T1G Nominal Output Voltage* 1.5 1.8 2.5 2.8 3.0 3.3 5.0 Marking LJP LJS LJT LJU LJV LJW LJX TSOP-5 (Pb-Free) 3000 Units/ 7 Tape & Reel Package Shipping
*Additional voltages in 100 mV steps are available upon request by contacting your ON Semiconductor representative. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
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NCP699
PACKAGE DIMENSIONS
TSOP-5 (SOT23-5, SC59-5) SN SUFFIX CASE 483-02 ISSUE F
NOTE 5 2X
D 5X 0.20 C A B
5 1 2 4 3
0.10 T 0.20 T L G A B S
M K
DETAIL Z
2X
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. DIM A B C D G H J K L M S MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00
DETAIL Z
J C 0.05 H T
SEATING PLANE
SOLDERING FOOTPRINT*
1.9 0.074
0.95 0.037
2.4 0.094 1.0 0.039 0.7 0.028
SCALE 10:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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NCP699/D

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